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Leze Laser Technology (Shenzhen) Co., Ltd. is a high-tech enterprise founded in 2017 by a team of seasoned engineers specializing in photonics and automation. Headquartered in Shenzhen, China, the company focuses on delivering advanced photonic packaging solutions for the semiconductor, industrial laser, and optical communication industries. With expertise in precision machining and system integration, Leze Laser provides both standardized and customized equipment to meet diverse client demands.
The company’s core offerings include burn-in/testing systems, precision assembly tools, and active alignment solutions. Notably, it has developed comprehensive die attachment and active alignment technologies capable of supporting mass production of high-speed optical modules up to 1.6T. Leze Laser also specializes in high-power COS (Chip-on-Submount) burn-in and test equipment, ensuring reliability and scalability for R&D and large-scale manufacturing environments.
Leveraging self-controlled core technologies, Leze Laser emphasizes high precision and automation in its D/B (Die Bonding) and W/B (Wire Bonding) equipment. The company is actively advancing 2.5D/3D packaging solutions for next-generation photonic devices, demonstrating its commitment to innovation. With rapid response capabilities and a global service network, Leze Laser has established partnerships with leading manufacturers worldwide, driving efficiency and technological breakthroughs across semiconductor fabrication and optical communication sectors.